Thermal Conductive Pad

Category： Thermal Management Products
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Silicone Thermal Conductive Gap Filler Pad could reach 16.0 W/mk Between heat-generation Component and heatsink Automotive engine control, Graphices Cards, Telecom device Wireless Hub,Military equipment, power supply Cooling Module, Thermal module,

1. High bond strength to surfaces

2. Thermal conductivity in combination with electrical isolation

3. Excellent wet out

4. High temperature stability

Application:

1.For CPU, LED,PPR heat sink, microprocessor
2.For any power consumption semiconductor
2.Replacing screws, fasteners and other fixed means
4.Fixing heat sink on the power supply circuit board
5.Fixing heat sink on vehicle control circuit board
6.Fixing heat sink on packaged chips

we could die cut any size and shapes as customer design.

TP-1600

TEST ITEM	TEST MOTHOD	UNIT	VALUE
SIZE		mm	400*200MM
COLOR	Visual		Blue
THICKNESS	ASTM D374	mm	0.3-10MM
GRAVITY	ASTM D792	g/cc	2.85±0.1
HARDNESS	ASTM D2240	Shore 00	25±5
TENSILE STRENGTH	ASTM D412	kg/cm²	55
TENSILE STRENGTH
ELONGATION	ASTM D412	%	60 95
TEMP	EN344	℃	-40～+220
VOLUME RESISTIVITY	ASTM D257	Ω•CM	3.1*10¹¹
BREAKDOWN VOLTAGE	ASTM D149	kv/mm	5
VOLUME IMPENDENCE	ASTM D257	Ω.cm	1.7×1013
Weight Damnify	200℃ 200H	%	≤1
Thermal Resistance	ASTM D5740	℃/ W	0.18
FLAMMABLITY	UL-94		V-0
THERMAL CONDUCTIVITY	ASTM D5470	w/(m•k)	16